SAD najavio 6,6 mlrd dolara subvencija za tajvanskog proizvođača čipova
Izvor:Hina
Autor:Helena Tučkorić
(FILE) TAIWAN TMSC LAWSUIT GLOBALFOUNDRIES
epa07957320 (FILE) - The logo of the Taiwan Semicondcutor Manufacturing Co. Ltd. (TSMC) hands on a building in Hsinchu, Taiwan, 02 November 2012 (reissued on 29 October 2019). On 29 October 2019, TSMC, the world's largest contract semiconductor manufacturer, and GlobalFoundries (GF), the world's second largest semiconductor foundry based in Santa Clara, California, announced that they have settled infringement disputes by agreeeing to cross-license each other's existing patents and patents to be filed in the next 10 years. GF filed the lawsuit in the USA and Germany on 26 August 2019. It sued TSMC for patent infringement, seeking to stop imports into the US and Germany of products made with the allegedly infringed technologies, and seeking damage from TSMC. TSMC denied the charges and vowed to file a counter-lawsuit. EPA/DAVID CHANG
foto DAVID CHANG
FotoID: HN:20191029325528
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WASHINGTON, 8. travnja 2024. (Hina/Reuters) - Američko ministarstvo trgovine objavilo je u ponedjeljak da će podružnici tajvanskog proizvođača čipova TSMC-a dodijeliti subvenciju od 6,6 milijardi dolara za proizvodnju sofisticiranih poluvodiča u Arizoni.
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